R: Soldering of Components on Printed-Circuit Boards

solder.balance {rpart} | R Documentation

## Soldering of Components on Printed-Circuit Boards

### Description

The `solder.balance` data frame has 720 rows and 6 columns, representing a balanced subset of a designed experiment varying 5 factors on the soldering of components on printed-circuit boards.

The `solder` data frame is the full version of the data with 900 rows. It is located in both the rpart and the survival packages.

### Usage

    solder

### Format

This data frame contains the following columns:

`Opening`

  a factor with levels L, M and S indicating the amount of clearance around the mounting pad.

`Solder`

  a factor with levels Thick and Thin giving the thickness of the solder used.

`Mask`

  a factor with levels A1.5, A3, B3 and B6 indicating the type and thickness of mask used.

`PadType`

  a factor with levels D4, D6, D7, L4, L6, L7, L8, L9, W4 and W9 giving the size and geometry of the mounting pad.

`Panel`

  `1:3` indicating the panel on a board being tested.

`skips`

  a numeric vector giving the number of visible solder skips.

### Source

John M. Chambers and Trevor J. Hastie eds. (1992) Statistical Models in S, Wadsworth and Brooks/Cole, Pacific Grove, CA.

### Examples

    fit <- rpart(skips ~ Opening + Solder + Mask + PadType + Panel,
                 data = solder.balance, method = "anova")
    summary(residuals(fit))
    plot(predict(fit), residuals(fit))

[Package rpart version 4.1-15 Index]